Most standard product offerings implement pin-point solutions to accelerate time to market and lower verification costs. As a consequence, design modifications result in lengthy development times and associated costs. Accent’s product approach is different. ASMgrid pre-integrates silicon proven technologies in a modular architecture and corresponding verification strategy to insure maximum solution flexibility. The techniques and technologies are the result of hundreds of successful customer solutions developed by Accent.
At the interconnect level, the platform utilizes a bus topology that has been tuned to numerous use case scenarios. DMAs and peripherals are organized based on bandwidth requirements as well as potential differences between different types of Smart Appliances. Appropriate system blocks incorporate Accent interface IP to support different bus architectures possibly required based on end-product specifications. Flexible low power options are also incorporated ranging from configurable power islands to circuit design techniques. All assumptions and critical product requirements have been tested in both software simulations as well as an FPGA development board, which is also available as an ASMgrid additional validation tool for customer design modifications.
The ASMgrid1.0 reference silicon device provides an additional verification milestone and has undergone extensive characterization separately and as a component in the ASMgrid development kit. The development kit, as mentioned previously, has also been certified as a ZigBee Compliant Platform.
ASMgrid1.0 reference silicon details
For those requiring a full-featured ASMgrid configuration and quickest time to market at lowest development cost, Accent offers the ASMgrid1.0 reference silicon device. The highly integrated silicon device integrates the functionality found in as many as 5 ICs. Alternatively, customers may work with Accent to define derivatives with a path to mass production in as little as 3-6 months.
ASMgrid1.0 Reference Silicon Details (continued)
. AMI and advanced Smart Meter
. Leading class RF performance
. Up to 50 percent BOM reduction
. Flexibility for future upgradeability
. ARM Cortex-M3 for application and communication processing
o 48 KB SRAM
o 60 DMIPS
. 2.4 GHz IEEE 802.15.4 radio transceiver and MAC
o ZigBee Pro Compliant
. Powerline Modem
o Integrated PHY and MAC
o IEC TS 61334-5-3 Compliant
o Guaranteed QOS
. 384 KB FLASH
. Embedded Temperature Sensor
. Communication Peripherals
o SPI, IIC, GPIO, Ext Mem I/Fs
. AES Hardware Accelerator
. Optimized Power Management
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