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3D TSV Test: ATE challenges and potential solutions

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resistion
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re: 3D TSV Test: ATE challenges and potential solutions
resistion   11/18/2011 9:14:06 AM
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Yeah, this is good article. Maybe recently many design articles pushed this quickly off the top view. First time I saw it, thanks to your post.

docdivakar
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re: 3D TSV Test: ATE challenges and potential solutions
docdivakar   11/18/2011 6:55:06 AM
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Good article, I am surprised no one commented (though I am late on this by several weeks!). The figures are unreadable, like figure 2, where I would like to learn more about the cost model used. The authors make a number of observations based on their cost model, some of which I find hard to agree with. These costs are very product-dependent and it is conveivable to have many dice for example in a 5-dice stack where the middle ones may need minimal test. The authors also gloss over details on how to probe TSV's & microbumps which are custom to each application/product. Some of the failure modes described in figure 1 can not be determined by the contemporary probing technologies. MP Divakar

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