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The Fast Track to 3D-IC Testing

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Upstream swimmer
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re: The Fast Track to 3D-IC Testing
Upstream swimmer   1/17/2012 5:24:27 PM
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Rather than using bumps to interconnect between substrates, why not use an anisotropic conductive film (ACF)? This would allow testing and rejection of any defective chips. - Peter C. Salmon peter@petersalmon.com

Edmond1
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re: The Fast Track to 3D-IC Testing
Edmond1   10/30/2013 9:44:34 PM
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It seems plausible:

Consider an 8-layer die stack and a total of 40,000 interconnections:

1. What would ACF's conductive particle sizes be (7um +/- 1um diameter ) ?

2. The ACF adhesive film would have to highly engineered for viscosity flow and curability.

3. Bond force and wafer warpage would be tricky.

 

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