The Exhibition part of the show runs 9AM-5PM on Tuesday the 19th, 9AM to 6PM on Wednesday the 20th, and 9AM to 3PM on Thursday the 21st. Here is a preview of what some of the exhibitors will be showcasing this year.
Lake Shore Cryotronics Booth 305 Lake Shore Cryotronics will be featuring its line of cryogenic and cryogen-free closed cycle refrigerator (CCR) probe stations. Lake Shore has ten distinct probe station models, including four cryogen-free CCR probe stations and six cryogenic models. The line of probe stations are well suited for non-destructive measurement of the electrical, magneto-transport, electro-optical, parametric, high-Z, DC, RF, and microwave properties of materials and test devices.
Molex Incorporated Booth 515 Molex will showcase a selection of its standard and custom RF coaxial connectors, cable assemblies and unique solutions for today's applications. With its subsidiary Temp-Flex LLC, Molex will display its microwave coaxial cables designed for high-bandwidth applications such as military and aerospace, defense, automatic test equipment and medical applications. Molex and Radiall will highlight their continued collaboration with the cost-effective SMP-MAX series featuring new symmetrical adapters and RF coaxial interconnect solutions for board-to-board, module-to-module and panel-to-panel telecom applications.
Also in the booth will be the Molex FAKRA II SMB connectors, which meet both American and German FAKRA automotive standards and offer a 360º rotation for easy routing inside the automobile and a secondary plug locking latch for increased reliability. Molex will also exhibit its Precision 2.4mm Compression-Mount Test Connectors, the industry’s only high-speed vertical PCB launch configuration operating to 50 GHz. NXP 607 NXP will be offering demos of its high-performance RF technologies and solutions in the categories of:
Wireless infrastructure: high-efficiency digital power amplifier, integrated SiGe based RF functions for an optimized BTS radio design board. The next step in BTS highly integrated LNA using SiGe:C.
Aerospace & defense: GaN power amplifier for C-Band, wideband medium PA for rugged environments.
High-performance RF in SiGe:C: low noise amplifiers for portable applications such as GPS, WLAN and FM.
Broadcast/ISM: 3 stage GaN power amplifier line-up
NXP will also be showcasing its recently announced, state-of-the-art VGAs offering high linearity, low noise and low power consumption across a wide frequency band.
Anritsu will be making several announcements centered on its VectorStar family of vector network analyzers (VNAs) . Among them will be a new noise figure measurement capability that will make VectorStar the only VNA platform capable of measuring noise figure from 30 GHz to 125 GHz.
Passive Plus, Inc. Booth 829 Passive Plus, Inc. offers a line of traditional Hi-Q high power, Low ESR/ESL, low noise, high self-resonance ultra-stable performance capacitors. Usually used for wireless broadcasting equipment, mobile base stations, GPS portables, MRI coils, and radar, these capacitors are 100% RoHS and offered in magnetic and non-magnetic terminations. Passive Plus now has available the popular 0505 series with part markings indicating part values.
Freescale Booth 901 Freescale will introduce several new RF products during IMS 2012. It will be demonstrating the RF performance capability of several new Airfast™ cellular infrastructure amplifier devices and showing how its wide video bandwidth capability, higher power densities and improved, Doherty-friendly impedances make these devices candidates for the next generation of base stations. It will also be showing a wide variety of GaAs and MMIC component solutions that are targeted for femto, pico, and small cell applications in the emerging Heterogeneous Network market space.
Freescale representatives will be speaking and/or organizing a variety of sessions during IMS, RFIC, and ARFTG.
Sunday, June 17, 1300 – 1700 (ARFTG) WSO: Advancements in Front End Modules for Mobile and Wireless Applications Organizers: Joseph Staudinger, Freescale Semiconductor., Freek van Straten, NXP, Gary Zhang, Skyworks Solutions Inc.
Monday, June 18, 0800 – 1700 (ARTFG) WMC: Advanced Techniques for Electromagnetic-Based Model Generation Organizers: Peter H. Aaen, Freescale Semiconductor, Michel Nakhla, Carleton University
Monday, June 18, 1000 – 1200 (RFIC) Room: 510BD RMO2E: Advanced Transmitters and Power Amplifiers Chair: Donald Lie, Texas Tech University Co-Chair: Joe Staudinger, Freescale Semiconductor
Tuesday, June 19, 1330 – 1600 (RFIC) Room: 517CD Interactive Forum, RTUIF17: A Novel mmWave CMOS VCO with an AC Coupled LC Tank V. P. Trivedi and K. To, Freescale Semiconductor
Tuesday, June 19, 1600 – 1720 (IMS) Room 512ABEF TU4B, Focus Session: Coupled Multi-Physics Modeling of High-Power and High- Frequency Electronic Devices Chair: Peter H. Aaen, Freescale Semiconductor Co-Chair: John Wood, Freescale Semiconductor
Wednesday, June 20, 1200 – 1320 (IMS) Room 516 AC Panel Session: How will LDMOS and III-V Device Technologies Play in Cellular Infrastructure Future Markets? Organizer: Basim Noori, Freescale Semiconductor Panelists: 1. Dr. James Wong, Manager RF Power at Alcatel-Lucent 2. Dr. Steve Cripps, Professor, Cardiff University 3. Ray Pengelly, Strategic Business Development Manager, Cree Semiconductors Inc. 4. Paul Hart, Systems Engineering Manager, Freescale Semiconductor 5. John Gajadharsing, Application Manager, NXP Semiconductors 6. Khan Salam, Principal Electrical Engineer (RFPA), Rockwell Collins Radio 7. Dr. Oleh Krutko, Device Design Engineering Manager, TriQuint
Wednesday, June 20, 1350 – 1530 Room: 512CDGH WE3C: Advances in CAD Algorithms Chair: Roni Khazaka, McGill University Co-Chair: Peter H. Aaen, Freescale Semiconductor
Thursday, June 21, 1330 – 1550 Room: 517CD THPP-1: High Power Solid-State Oscillator for Microwave Oven Applications T. Shi, K. Li, Freescale Semiconductor
Thursday, June 21, 1430 – 1450 TH3D-4: A 350W, 2GHz, 44% Efficient LDMOS Power Amplifier Design with Capability to Handle a Wideband 65MHz Envelope Signal A. M. Ahmed, J. Babesku , J. Schultz, H. H. Ladhani, J. Jones, M. Bokatius, P. Hart, Freescale Semiconductor
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments