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Electromagnetic modeling of three dimensional integrated circuits

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re: Electromagnetic modeling of three dimensional integrated circuits
docdivakar   6/25/2012 7:43:54 PM
Nice description of modeling 2.5D & 3D IC stacked with Si interposers. What is not clear from the article is whether or not the compact models can be used in the preliminary design of the substrates including the interposers. The location of the TSV's otherwise becomes a cumbersome design-simulate-validate-redesign... cycle! MP Divakar

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