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Die bonding techniques and methods

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docdivakar
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re: Die bonding techniques and methods
docdivakar   7/12/2012 3:43:22 PM
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The authors fail to mention a very important criterion that must be met irrespective of the die bonding method chosen -that is the control of voiding in the three processes discussed. MIL-STD-883 has excellent writeup on what different voiding percentages look like in die attach. Voiding also has significant effects in junction temperatures in the die. MP Divakar

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