Breaking News
Design How-To

FPGA-based instrumentation withstands chill in deep space

NO RATINGS
Page 1 / 3 Next >
More Related Links
View Comments: Newest First | Oldest First | Threaded View
elektryk321
User Rank
Rookie
re: FPGA-based instrumentation withstands chill in deep space
elektryk321   9/13/2012 7:55:54 AM
NO RATINGS
High temperature makes problems with silicon devices by fast electrons movement and power dissipation. Low temperature makes no problem for silicon design itself, but for mechanical design like wiring inside package, crystal oscillators or electrical interconnects. I do not feel this mechanical problems are big deals for any other IC manufacturers.

LJL1
User Rank
Rookie
re: FPGA-based instrumentation withstands chill in deep space
LJL1   9/13/2012 6:47:09 AM
NO RATINGS
One might expect that the differential shrinking between metal and silicon would cause broken traces on the die. Can you say whether or not this may have happened?

Most Recent Comments
Flash Poll
Radio
LATEST ARCHIVED BROADCAST
Join our online Radio Show on Friday 11th July starting at 2:00pm Eastern, when EETimes editor of all things fun and interesting, Max Maxfield, and embedded systems expert, Jack Ganssle, will debate as to just what is, and is not, and embedded system.
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week