Breaking News
Design How-To

Addressing signal electromigration (EM) in today’s complex digital designs

NO RATINGS
2 saves
Page 1 / 4 Next >
More Related Links
View Comments: Newest First | Oldest First | Threaded View
docdivakar
User Rank
Manager
re: Addressing signal electromigration (EM) in today’s complex digital designs
docdivakar   1/29/2013 8:53:03 PM
NO RATINGS
The article clearly needs to emphasize the metric current density vs. current magnitude whether effective, RMS or average values! Temperature effects are of course important but current densities all the way to chip-to-chip (in case of 3D / 2.5D IC) and chip-to-package-level interconnects. Metal lines in IC can take 1E6 Amp/cm^2 current density but interconnects (flipchip or wirebond) and TSV's have lower limits. MP Divakar

Most Recent Comments
August Cartoon Caption Winner!
August Cartoon Caption Winner!
"All the King's horses and all the KIng's men gave up on Humpty, so they handed the problem off to Engineering."
5 comments
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Flash Poll
Radio
LATEST ARCHIVED BROADCAST
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.