Design Con 2015
Breaking News
Design How-To

Addressing signal electromigration (EM) in today’s complex digital designs

NO RATINGS
2 saves
Page 1 / 4 Next >
More Related Links
View Comments: Oldest First | Newest First | Threaded View
docdivakar
User Rank
CEO
re: Addressing signal electromigration (EM) in today’s complex digital designs
docdivakar   1/29/2013 8:53:03 PM
NO RATINGS
The article clearly needs to emphasize the metric current density vs. current magnitude whether effective, RMS or average values! Temperature effects are of course important but current densities all the way to chip-to-chip (in case of 3D / 2.5D IC) and chip-to-package-level interconnects. Metal lines in IC can take 1E6 Amp/cm^2 current density but interconnects (flipchip or wirebond) and TSV's have lower limits. MP Divakar

Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week