Breaking News
Design How-To

ST-Ericsson benefits from debts write-off

2/4/2013 11:31 AM EST
4 comments
NO RATINGS
More Related Links
View Comments: Newest First | Oldest First | Threaded View
Peter Clarke
User Rank
Author
re: ST-Ericsson benefits from debts write-off
Peter Clarke   2/6/2013 9:43:03 AM
NO RATINGS
@eewiz NovaThor is in four Samsung phones we are told ..and the rumor is that NovaThor has been designed into the Galaxy S4..... I don't know when that one comes out.

trekorvar
User Rank
Author
re: ST-Ericsson benefits from debts write-off
trekorvar   2/5/2013 1:34:36 PM
NO RATINGS
Figures mentioned during last weeks analyst call: 4250 employees + 500 contractors, of which 40% Modem, 35% ModAp, 10% Connectivity & Entry, rest in Sales and other functions.

eewiz
User Rank
Author
re: ST-Ericsson benefits from debts write-off
eewiz   2/5/2013 9:46:45 AM
NO RATINGS
"In 4Q12, NovaThor ModAp shipments grew by 45 percent sequentially to 10.7 million units." Some good numbers from STE for a change. BTW is this chip designed into any other popular phones? I doubt whether samsung sold 10.7m S3 mini's by now, which just started rolling out in many parts of the world.

krisi
User Rank
Author
re: ST-Ericsson benefits from debts write-off
krisi   2/4/2013 5:32:31 PM
NO RATINGS
How many people do they have?

Most Recent Comments
michigan0
 
SteveHarris0
 
realjjj
 
SteveHarris0
 
SteveHarris0
 
VicVat
 
Les_Slater
 
SSDWEM
 
witeken
Most Recent Messages
9/25/2016
4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed