SAN FRANCISCO—Fabless chip vendor Broadcom Corp. Tuesday (Feb. 12) rolled out what it claimed to be the semiconductor industry's smallest 4G LTE-Advanced modem for tablets and smartphones.
Broadcom (Irvine, Calif.) said the BCM21892 is compliant with all specifications developed by the 3rd Generation Partnership Project (3GPP). The chip offers a full-featured cellular baseband with a world-band radio in a footprint that is about 35 percent smaller than competing chips, Broadcom said.
Advanced power management techniques used by the BCM21892 save up to 25 percent of the power typically consumed during data transmissions to the network, according to Broadcom. The company said the new modem also supports LTE Category 4 speeds of 150 Mbps, operates in any 3GPP network and performs seamless hand-offs between the various 4G LTE, 3G and 2G interface technologies.
"Broadcom's new 4G LTE modem combined with our Wi-Fi, Bluetooth, GPS and NFC technologies gives OEMs all the communications technologies needed to build advanced devices that will offer consumers the features, speed and functionality they demand in their next smartphone purchase," said Robert A. Rango, Broadcom executive vice president and general manager of its mobile and wireless group.
According to Peter Cooney, an analyst at ABI Research, 4G LTE coverage is seen as a competitive differentiator by carriers to meet consumer demand for better performance. "Based on its success in executing and integrating baseband processors, Broadcom is well positioned to deliver the latest mobile broadband technologies for these next generation devices," Cooney said.
The BCM21892 is now sampling to early access customers, with anticipated production in 2014, Broadcom said. The company said it would showcase all its 4G LTE innovations at the upcoming Mobile World Congress show in Barcelona later this month.