LONDON – Specialty foundry Altis Semiconductor SA has been signed up as a foundry partner for IBM Microelectronics running a 180-nm silicon-on-insulator (SOI) manufacturing process.
The long-term agreement includes radio frequency chipsets on SOI used in mobile devices. Altis (Corbeil-Essonnes, France) has been signed up to use the 7RFSOI process from IBM to deliver RF in high volume starting in the second quarter to meet forecasted demand for 2014 and beyond.
The 7RFSOI process is said have advantages over other processes by enabling high-levels of performance and integration for large numbers of solid-state switches needed in multi-mode multi-frequency smartphones. Examples include cellular antenna switches, diversity antennas and wireless LAN, Altis said.
Altis started out as an IBM Microelectronics wafer fab and was sold in part to form a 50:50 joint venture with Infineon Technologies AG (Munich, Germany) in 1999. Altis was then sold in its entirety in 2010 to French entrepreneur Yazid Sabeg.
Related links and articles:
Altis preps wafer shuttle for embedded CBRAM
Adesto ramps CBRAM, with Altis
Altis to join foundry fray, Infineon says