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3-D integration takes spotlight at ISPD

3/26/2013 03:57 PM EDT
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Francoise.vonTrapp
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re: 3-D integration takes spotlight at ISPD
Francoise.vonTrapp   4/2/2013 10:51:36 PM
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I asked Liam Madden that question during his keynote at 3D ASIP, to which he replied, "to an engineer, it's 2.5D. To the marketing department, it's 3D IC." Hope that helps.

chipmonk0
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re: 3-D integration takes spotlight at ISPD
chipmonk0   3/26/2013 5:28:49 PM
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Colin : From your desciption it appears that strictly speaking the new Xilix module ( just like their first one ) is NOT a 3-d but 2.5d ( i,e. no pesky TSVs in active dies, only in Si interposers and no stacking of active dies ). Can you comment please.

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