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3-D integration takes spotlight at ISPD

3/26/2013 03:57 PM EDT
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chipmonk0
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re: 3-D integration takes spotlight at ISPD
chipmonk0   3/26/2013 5:28:49 PM
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Colin : From your desciption it appears that strictly speaking the new Xilix module ( just like their first one ) is NOT a 3-d but 2.5d ( i,e. no pesky TSVs in active dies, only in Si interposers and no stacking of active dies ). Can you comment please.

Francoise.vonTrapp
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re: 3-D integration takes spotlight at ISPD
Francoise.vonTrapp   4/2/2013 10:51:36 PM
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I asked Liam Madden that question during his keynote at 3D ASIP, to which he replied, "to an engineer, it's 2.5D. To the marketing department, it's 3D IC." Hope that helps.

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