With Microchip's recent acquisitions the company has already moved into
multi-die components and sensors, bringing the possibility of ultra
compact, ultra low power, wireless sensor nodes from Microchip closer.
are already interacting with all sorts of sensors. We make some
on-chip; temperature sensors and voltage sensors," said Sanghi. In 2012
Microchip acquired Ident Technology AG (Gilching, Germany), a company
developing 3-D gesture recognition technology based on electric field
This resulted in November 2012 in the MGC3130 chip.
This $2 chip generates an electrical field in the 70-kHz to 130-kHz
frequency range that extends out from the chip about 15 centimeters.
That field is affected by the presence of almost anything in the field
and the changes are sensed using thin PCB trace electrodes. The chip
uses just 150 microwatts in an always-on, wake-on-motion mode. It burns
90 milliwatts at full throttle.
Sanghi agreed that the sensors
Microchip currently works with are the types of sensors that are
compatible with mainstream IC manufacturing processes. "We don't have
the MEMS technology in house today," he said.
Does that mean MEMS
technology and multi-die packaging is on the horizon from Microchip?
Sanghi brings the conversation back to earth with a financial bump.
"It's the sort of thing we think about for acquisition strategy. But
MEMS has become a commodity. There's not necessarily any money to be
made there," he said.
Will the acquisition run that Microchip has been on for several years--at an accelerated pace the past two years--continue? Many of the acquisitions have been small and for undisclosed
amounts of money. The largest was SMSC for about $750 million in May
2012. Sanghi makes it clear the interest in acquisitions is still there
but there is no set schedule. "We're constantly looking for deals
because deals are hard to make," he said.
Thank you Peter. A least one voice of reason here.
Not everything Silicon Valley (where I leave and work) makes or thinks of is all we need, and not all we need comes from Silicon Valley.
Steve Sanghi is one of the smartest people in this industry. Just the fact that he knew how to turn around a failing NVM company and make good dough for over 20 years as its head, navigating it safely around troubled waters and keeping it financially strong, is deserving a lot of credit.
The Tesla example is perhaps misused by Peter, or Maybe overly emphasized. Don't just use one quote to dismiss the whole person. Read carefully, there's some wisdom in there.
You are entitled to have an opinion, although clearly "junk" is a generally considered a derogatory term.
It would be helpful to other readers to elaborate on any issues you see.
People do buy a considerable numbers of Microchip ICs and one person's "cheap" is another person's value for money.
I wish the exec described a more broader and appealing use case than the one with Tesla. To that end, to make some of the vision at Microchip happen, the question on "MEMS technology and multi-die packaging is on the horizon from Microchip?" is a relevant one. For one, I have not come across initiatives or efforts from Microchip to take part in industry standards bodies and events to make its efforts known.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.