WEST WARWICK, R.I. Advanced Interconnections' molded BGA socketing system has a pin-to-pin pitch of 1 mm (.039 inch). The BGA device is soldered to an adapter, converting it to a pinned device that can be mated to a socket soldered to the board.
The design is said to ensure a coplanarity that is consistently under the industry standard of .006 inch (0.152 mm). The technique is designed to simplify BGA device upgrade, replacement, repair, test and emulation.
Process yields using the BGA Socketing System are equivalent to direct attach, Advanced Interconnections said. Eutectic solder balls reflow at standard solder process temperatures.
The system accommodates a range of footprints. An optional extraction slot aids in adapter removal. The series is available in tape-and-reel packaging for automated assembly.
Because of the number of variables involved in specifying any given application, pricing will be quoted per an OEM's requirement.
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EETInfo No. 628