PHOENIX, ARIZ. Z-LOK zero insertion force (ZIF) ball-grid array sockets for surface-mount applications are available from Wells-CTI. The one-piece, cam-operated sock-ets can be soldered into position and used with all BGA package types, which isn't the case with other multipart BGA socket assemblies, according to the company.
The Z-LOK sockets permit repeated tool-free removal and insertion of new BGA-packaged processors from and to pc boards without solder ball damage or signal loss. The sockets' cam and top-plate actuation generates a gas-tight interconnection with each insertion and removal, and the sockets help eliminate strains in BGA packages that could otherwise result from mismatched coefficients of thermal expansion. The Z-LOK sockets are priced at 15 cents per line in 1,000-piece quantities and .035 cent per line in 100,000-piece quantities.
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Wescon Booth 144
EETInfo No. 626