Fremont, Calif. - ASAT Holdings and ASAT Inc., which provide outsourced assembly and testing services for semiconductor manufacturers, have added a Thin Array Plastic Package (Tapp) to their Kestrel family. The package, which conforms to Jedec quad, flat no-lead dimensions, is designed for use in mixed-signal devices, mobile communications, Internet, data network and broadband applications.
The Tapp is 0.8 mm thick at maximum, accommodates more than 200 I/O connections, is free of lead and has optional power and ground rings to improve electrical characteristics, ASAT said.
It is based on a "pad frame" design that employs SAW singulation (instead of stamping) to create a large, exposed die-attach pad area that is mounted on the pc board. The design is said to enhance thermal performance and permit the package to adapt to various body sizes and footprints.
Lead time for tooling specific options is nine days or less and tooling is done at no cost to customers. Tapp prices for multiring designs start at 1 cent per I/O.
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EET Info No. 616