EtroniX, the new electronics technology umbrella event that opens at the Anaheim Convention Center in Anaheim, Calif., today, provides the design community with a wide array of products that range from advanced packaging and components to test and production equipment. Co-located with EtroniX is a new springtime version of the long-lasting Wescon show that now alternates in the October time frame between Anaheim and San Jose. EtroniX and Wescon Spring will be held through March 1.
EtroniX is billed as a six-shows-under-one-roof event that consists of Design Expo, MP International, e/manufacturing, EvaluTech and Nepcon Production & Support. Like the fall event, Wescon will focus on a broad selection of electronic components that includes connector and cable assemblies, passive components, electromechanical components, LEDs and other optoelectronic devices and printed-circuit boards. Many of those components are presented on pages 148 through 152.
Visitors at the shows will find some of the newest products from suppliers like 3M, Agilent Technologies, Amkor Technology, GenRad, SPEA,Fluke, Hewlett Packard, IFS, Keithley, Kulicke & Soffa, National Instruments, Nicolet, Northwest Analytical, Palomar Technologies and Teradyne.
The co-location of Wescon Spring and EtroniX will fill the need of the entire design team to meet in one place, said Donna Call, COO of Electronic Conventions Inc., which manages Wescon Spring.
The test and inspection portion of Nepcon West has evolved into a show and conference of its own. The new EvaluTech Exhibition and Conference will feature a full range of automated electronics test equipment, vision systems, software and evaluation tools, and the latest education for test engineers and other electronics manufacturing professionals. SPEA, a leading automatic test equipment vendor, will showcase its 4040 flying probe tester at EvaluTech. National Instruments will display its software and modular hardware. The PXI Systems Alliance will also be participating in EvaluTech 2001.
A full range of automated design tools, advanced software and the latest education will be on hand for design engineers and other electronics manufacturing professionals at the new Design Expo and Conference. MP International will bring packaging professionals and leading suppliers together at an all-new microelectronics packaging exhibition and conference, and showcase the advanced packaging technologies driving growth in the worldwide electronics industry.
The Nepcon Production & Support Exhibition and Conference will feature the latest electronics production equipment, and materials and services for electronics manufacturers, including adhesives, fiber optics, pc-board design tools, pc-board production equipment, pc-board materials software and supplies, rework and repair, soldering equipment and test equipment. Participants can attend sessions with such topics as lead-free solder technology; solder defects; prevention and rework for wave, reflow and cleaning; fine-pitch PCB design for manufacture and assembly; reliability of BGA, flip-chip and chip scale assemblies.
A full range of supply-chain management tools, enterprise solutions, information systems and cutting-edge education will be on hand for electronics manufacturing professionals at the new e/manufacturing expo and conference. The e/manufacturing exhibits will showcase such supply-chain management tools as enterprise software (MRP, ERP), e-business, e-commerce, e-procurement, EDI and warehouse management.
Conference programs accompany each of the EtroniX events. Participants can choose from over 100 solutions-oriented conference sessions, where they will hear key speakers from companies like Alcatel USA, Boeing, Cadence, Cisco Systems, DuPont, IBM, Loctite, Lucent Technologies, Motorola, Northrop Grumman, Packard Hughes, Qualmark, Raytheon and others. Hot topics and future trends will be the focus with topics that include Linux in test applications, lead-free solder technology, applications and advances in 3-D and thin packaging technologies and hardware/software co-design.
Participants can take in free keynote addresses each morning of the show. On Tuesday, Celestica senior vice president of corporate strategies, Arthur P. Cimento, will offer an in-depth look at the role of EMS companies in the electronics industry. Then on Wednesday, futurist and best-selling author Watts Wacker will forecast the challenges and opportunities of the future and help viewers prepare to meet them. On Thursday, former NASA engineer and best-selling author Homer H. Hickam Jr. translates his inspirational journey from the coal mines of West Virginia to the heart of NASA into valuable tools for success. Several special events take place daily at EtroniX, including the Advanced Packaging Symposium focusing on critical issues of wafer-level chip-scale packaging.