Irvine, Calif.- Intersil Inc. has put voice-over-Internet Protocol (VoIP) ringing subscriber-line interface circuits (SLICs) in 7- x 7-mm packages, claiming the parts are among the smallest such devices available.
The package occupies less than one-third the board space of the 28-lead, 12.5- x 12.5-mm plastic devices commonly used for the application.
According to Intersil, that effectively triples the line-circuit packing density of voice-over-digital subscriber line, cable modem and broadband wireless access gateway and router products for the home, as well as integrated access device and PBX enterprise products, and data-link control and pair gain equipment for loop carrier applications.
The package for Intersil's HC55185 is one-fourth the height of the larger package, said Michael Althar, vice president of Intersil's voice-over-IP gateway products. He added that the thermal characteristics are also improved because the exposed die-mount pad makes direct contact with the pc board and serves as a direct heat-sinking path. Lead coplanarity isn't a problem, Althar said, because the interconnect pads are integrated into the package's plastic body. The part can be mounted with standard production equipment and without special soldering processes.
The new device and Intersil's recent ISL5586 add Data Over Cable System Interface Specification 1.1 to the RSLIC18 ringing SLIC family.
The HC55185 is available in commercial and industrial temperature grades, longitudinal balance grades of 53 dB and 58 dB and high battery voltage (Vbh) ratings of -75 volts, -85 V and -100 V. Unit prices in 1,000-piece quantities range from $3.71 for a device rated for the commercial temperature range, 53-dB longitudinal balance and -75-V Vbh to $5.59 for an industrial-temperature version with 58-dB longitudinal balance and -100-V Vbh. Production quantities should be ready by the end of March.
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EETInfo No. 622