Camarillo, Calif. - An inspection system that delivers higher-contrast images for easier detection of failures in low-absorption materials within chip packages has been launched by Phoenix X-ray Systems + Services Inc. The high-contrast detector makes it possible to integrate nonconductive die-attach materials without the need to dope with silver, the company said. The image quality is said to enable superior detection of prepreg and molding voids, and of microvias.
The fundamental components of any X-ray inspection system are the tube, manipulator and imaging chain. A traditional chain contains an image intensifier with an optimized camera. The Phoenix high-contrast detector replaces the intensifier with a digital detector technology and video system that claim to deliver superior, distinct images in pseudo real-time. The clearer the images, the more quickly, accurately and reliably the software or operator can interpret and analyze for defects, Phoenix said.
Prices vary by application, but Phoenix anticipates that the most common system will be a package/analyzer with the high-contrast detector for semiconductor package inspection, at around $210,000.
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EETInfo No. 646