Milpitas, Calif. - The HDMP-2840 Infiniband switch IC from RedSwitch Inc. includes eight full-duplex ports, each running at 10 Gbits/second, and 32 serializer/deserializer physical-layer chips. It provides 160 Gbits/s of wire-speed bandwidth and can eliminate up to 40 chips from the design of an eight-port, 4x Infiniband switch.
The IC includes circuitry to implement subnet-, performance- and baseboard-management agents, and it can operate without the support of a microprocessor. An embedded clock moves data at 10 Gbits/s per connection in backplane applications, vs. 0.3 Gbits/s with conventional backplanes that use an external clock.
The device includes a 20-kbyte input buffer and a 5-kbyte output buffer per port. Its 16-kbyte internal memory holds up to 16,383 unicast routing table entries. An additional 512-byte memory is available for a multicast routing table. Eight virtual lanes are programmable to 1, 2, 4 or 8 for hastening delivery of priority packets. Virtual lane arbitration supports 32 high-priority and 32 low-priority weight pairs.
The part can handle the 4-kbyte maximum Infiniband packet size, which allows encapsulation and transport of Internet Protocol packets. A nonblocking architecture allows packets waiting. A microprocessor interface lets developers add their own management software to supplement built-in management agents.
An I2C interface allows system configuration via external NVRAM and for passing diagnostic commands, such as triggering loopback testing of each Infiniband port on the chip. Built-in self-test and power-on self-test blocks are provided.
RedSwitch is funded by Agilent Technologies Inc. (Santa Clara, Calif.) and Fujitsu Microelectronics Inc. (San Jose, Calif.). Its highly integrated chip, developed jointly with Agilent, is one of the first eight-port Infiniband switch chips and one of the highest-performing devices in its category, RedSwitch president and CEO Wen Li claimed.
Li said RedSwitch and Agilent are applying for a dozen patents on the new technology the device employs.
Samples will be available this month, with volume production set to follow in the first quarter of 2002. The HDMP-2840 is packaged in a 400-pin ceramic ball-grid array and is priced at $600 in 1,000-piece quantities.
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EETInfo No. 608