Atlanta - Wickmann USA's newest FCD series surface-mount chip fuses use metal film technology on a heat-resistant and nonflammable ceramic substrate to offer what the company said is greater heat and shock tolerance than other glass-substrate surface-mount fuses. The devices feature a low internal dc resistance, critical in the protection of sensitive low-voltage equipment. Metal film material is economical but exhibits stable and repeatable fusing characteristics, according to Wickmann.
The FCD family covers the complete EIA standard footprint range of 0402, 0603, 0805 and 1206. The smallest available size-the 0402 footprint-is the best solution for any application where miniaturization is the primary need, the company said. Current ratings range from 250 mA to 5 A, with rated operating voltages up to 50 Vdc. Terminations of the fuses are plated with a tin/lead coating and are compatible with IR reflow installation processes. Lead-free versions are due later this year. UL approves all FCD fuses, which ship in blister tape-and-reel packaging. Unit pricing is 12 cents each in OEM quantities.
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