Frenchtown, N.J. - Aries Electronics Inc.'s BGA/CSP test and burn sockets are designed for devices with a pitch of 0.5 mm or larger in frequency applications up to 1 GHz. The sockets are suitable for test and burn-in of chip-scale, MicroBGA, DSP, LGA, SRAM, DRAM and flash devices, and can accommodate any package size up to 13 mm2, the company said.
The sockets feature solderless pressure-mount compression spring probes. The compression spring provides the appropriate force against the device and allows for height variations in the thickness of the device, said the company. The contact force of the spring probe is 9 g's to 12 g's per contact for 0.5- to 0.75-mm pitches and 17 g's to 20 g's per contact for 0.8-mm pitches and larger. The socket's small size allows for the maximum number of sockets per burn-in board as well as burn-in boards per oven. The sockets can accommodate up to 500,000 cycles and are available in custom materials, platings, sizes and configurations. The operating temperature is -55 degrees C to 150 degrees C.
Pricing for a 100-lead socket starts at $175 in single-piece quantities. Delivery is two weeks.
Call (908) 996-6841