Frenchtown, N.J. - Aries Electronics Inc. offers a new RF test socket for devices up to 13 mm wide, with 0.5-mm pitches, for applications with speeds from 1 to over 10 GHz. The sockets are designed for devices such as CSP, MicroBGA, QFN, DSP, LGA, SRAM, DRAM and flash memory.
The center-probe test socket's signal path during test is .077 inch, which provides for a minimal signal loss for higher-bandwidth capability and a longer cycle life in automated handler testing. The company said that, for example, the socket can achieve -1 dB of bandwidth at 11 GHz and a 0.5-mm pitch.
Center-probe contact forces are rated at 9 g to 12 g per contact for 0.5- to 0.75-mm pitches and 17 g to 20 g per contact for 0.8-mm pitches and larger. The estimated contact life is more than 500,000 cycles. The operating temperature range is -55 degrees C to 150 degrees C. The spring probes are heat-treated beryllium copper alloy, and all of the hardware is stainless steel.
The socket is said to ensure reliable contact mating, accurate placement, and easy mounting and removal to and from the load board, thanks to a four-point spring probe crown, raised point probe and solderless, pressure-mount compression-spring probes. It is available in custom materials, platings, sizes and configurations. Prices for the 100-lead molded BGA socket, up to 3 GHz, start at $450. Delivery is two weeks.
Call (908) 996-6841