Milpitas, Calif. - California Micro Devices will introduce what the company calls a pioneering complete product portfolio of lead-free (Pb-free) application-specific integrated passives (ASIP) products for wireless handsets and personal digital assistants (PDAs).
Beginning on Oct. 1, all of Cal Micro's mobile chip-scale package (CSP) ASIP devices will be available with lead-free solder balls. The highest volume products are available in samples now, including the CSPEMI306G and CSPEMI307G. Volume production will be available for all lead-free products in the fourth quarter.
In addition, Cal Micro has announced a new OptiGuard CSP backside coating process for mobile products that provides additional protection from die chipouts and microfissures that can occur as a result of handling in manufacturing. The coating is available as a standard product option for all of its ASIP devices for wireless handsets and PDAs. Samples are available now.
The lead-free CSPEMI306G and CSPEMI307G are priced at $0.495 each in quantities of 1,000. Samples are available now with volume production scheduled for the fourth quarter. The OptiGuard 306A and 307A (CM1400-03CS and CM1401-03CS) are priced at 62 cents each in quantities of 1,000. Delivery for volume production is eight to 10 weeks.
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