Have trouble testing ball grid array (BGA) designs? Packaging and connector maker Advanced Interconnections Corp. (West Warwick, Rhode Island) says its now offering custom-engineered microchip-socketed test fixture boards.
These are intended to electrically interface your test gear to BGAs. The goal is to eliminate time-consuming soldering of BGAs to adapters.
Fabbed from multi-layer FR-4, these products use cable-to-board connectors (interfacing to a test system) and the company's patented True BGA Socket (into which chip packages are inserted during testing).
The test-fixture boards are typically designed with SMT using vias to make required trace-to-trace connections between board layers; the cable-to-board connectors are surface mounted.
In use, only the socket itself is soldered to a board. The BGA package-under-test is then placed on top of the socket, covered with a support plate, and secured by sliding a clamp in place over the BGA and then tightening a coin screw or heatsink. Electrical continuity is assured by the use of spring-loaded beryllium-copper contacts loaded in so-called pogo pin terminals, the heads of which are compressed against the balls of the BGA package, to create a gas-tight seal.
For more information, contact Advanced Interconnections' customer service department at 5 Energy Way, West Warwick, Rhode Island 02893. Phone: (800) 424-9850 or 401-823-5200. Fax: (401) 823-8723. E-mail: email@example.com.
Product information is also available on-line at Advanced Interconnections' Web site.
--- AMM (30 Oct. 2003)