Lisle, Ill. Achieving high density and increased speeds up to 2.5 Gbit/s of bandwidth per signal pair in mezzanine board-to-board applications, the new VHDM 8-row stacker system from Molex Inc. is designed for both single-ended and differential signaling. The system may be used in telecommunication equipment, test systems, high-end servers, memory storage systems, and cellular base stations.
The VHDM 8-row stacker system has a high speed/high density mezzanine design with an 18.00-mm (.709 inch) stack height and 100 real circuits per inch. With a 2.00 x 2.25-mm (0.79 x 0.89-inch) pitch, the system provides 40 contacts per centimeter. It uses the same proven wafer design, separable interface, and press-fit compliant pins as the standard VHDM connector family. In addition, the new stacker system also offers flexibility for parallel board connections and has less than five percent cross talk.
The system has a wafer construction that accurately permits ground plane locations relative to the signal contacts for improved impedance control. Its eye-of-the-needle, press-fit receptacles and headers allow for tight spacing without solder bridging between contact tails. It also allows for a highly reliable termination to the PC-board, and ease of repair.
The system mates with existing standard VHDM backplane headers. It provides ground planes between signal columns that provide tightly controlled impedance for rise times as low as 200 picoseconds, as well as very low cross talk between signals within a column and between signal columns.
Volume pricing for the VHDM stacker system ranges as low as $0.34 per mated line. Typical delivery is seven weeks.
Call (630) 969-4550