Eagan, Minn. Users can socket their 0.8-mm pitch, 189 ball BGA/CSP devices without performance loss with Ironwood Electronics' new high performance 6.5 GHz bandwidth sockets.
The new SG-BGA-6103 sockets support very dense BGA stacked devices using a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket accommodates IC packages such as the JEDEC MO-207 BGA, 0.8-mm pitch BGA/CSP devices, and 21 x 9 arrays with up to 189 balls.
These patented ZIF sockets are mechanically mounted to the target PC-board. The sockets are 7.5 mm high and only slightly larger than the actual IC packages to minimize footprint on system boards. The socket is designed to dissipate up to 5 watts.
Pricing for the SG-BGA-6103 socket is $373.50 at quantities of 100.
Call (651) 452-8100