Cary, N.C. To enable packaging analysis early in the design cycle and to drive MEMS commercialization, Coventor, Inc., a MEMS design software developer, and Kyocera, a leader in IC and MEMS package solutions, have partnered to provide software libraries for microelectromechanical systems (MEMS) applications. The package libraries, developed jointly by the companies, contain software models for a variety of MEMS-compatible open tool hermetic ceramic packages, which are offered in Kyocera's product portfolio. The package library design information will be available in third quarter 2004 at no charge to new and existing CoventorWare software customers.
Due to the high-cost of packaging, which can be as much as 80% of the overall cost of MEMS development, advanced packaging tools for MEMS devices are crucial to cost-effective development, said Coventor. The company believes that the availability of open tool standard package models in the designer's CAD environment will shorten design times significantly by enabling more rapid package selection, and tighter integration with the package development group, which will increase system robustness through MEMS package co-design and simulation. This will also lead to reduced time-to-market and lower overall costs, said the company.
The package library will initially target RF, inertial and infrared MEMS applications and will include elements such as package mask, process descriptions, material property data, and 3D detailed models. It will also initially enable users to couple MEMS devices and Kyocera standard packages for analysis of thermomechanical effects, low and high frequency coupled RLC effects, as well as failure modes and design for reliability in the future.
In addition, coupled device/package macro model extraction is supported for Cadence and Synopsys environments which will provide users with the ability to include package stress effects at the system level to create more robust designs, said the company.
The standard package library contains models for SMD (surface mount device), S/B (side braze), PGA (pin grid array), C-DIP (Cerdip) and LCC (leadless chip carrier) packages.
Kyocera packaging libraries will be available with CoventorWare software in third quarter 2004.
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