Milpitas, Calif. California Micro Devices has announced the sampling of chip scale package (CSP) Application Specific Integrated Passive (ASIP) devices with 0.40-mm pitch and 0.25-mm CSP solder balls to key strategic customers. A market and technology leader in CSP and advanced ASIP designs for the handset market, California Micro Devices is the first supplier of integrated passive solutions to offer 0.40-mm pad pitch CSP ASIP devices in volume production. These fine pitch CSP products represent a solution form factor reduction of greater than 20% compared to industry standard 0.50-mm pitch CSP products. In addition, the smaller die size provides a path for future solution cost reduction.
"Our customers' familiarity with both CSP and fine pitch ball grid array (BGA) packages has progressed to the point where they are ready to make the transition to 0.40-mm pitch CSP ASIP devices while maintaining high production yields," said Kyle Baker, vice president of marketing for California Micro Devices. "The migration to fine pitch CSP ASIP devices provides value to our customers through a significant reduction solution form factor, and cost and is the next stage in the evolution of CSP devices. Just as the initial CSP products with 0.65-mm pad pitch were displaced by devices with 0.50-mm pad pitch, those in turn will be succeeded by devices with 0.40-mm pitch."
California Micro Devices' growing portfolio of CSP ASIP devices delivers the highest levels of electromagnetic interference (EMI) filtering combined with robust electrostatic discharge (ESD) protection. Utilizing an application specific design methodology, the company produces highly integrated CSP solutions that address the passive function requirements for leading handset data interfaces, including the color LCD, CMOS imager, audio and chip card interfaces. These high-volume, general customer solutions are designed into the latest wireless handsets from such leading vendors as LG, Kyocera, Motorola and Samsung, among others.
The 0.40-mm pitch CSP products are available in both eutectic and lead free formats to meet the project's requirements. Evaluation boards will be available for these new CSP products on June 24, 2004.