eASIC Corp, a provider of breakthrough Structured ASIC technology and products, announced taping out of its first Structured ASIC array to be fabricated by a European IDM partner at 0.13 micron process technology. The taped-out array called FA1, is the smallest member of the company's Structured eASIC product family. The initial parts will be used to characterize timing and power for the Structured ASIC fabric and cell libraries. The complete product family is scheduled to be released for production in early Q1 2005. This product is being co-developed with Flextronics Semiconductor who will also be offering Structured ASIC products and services. eASIC Corporation, San Jose, CA 95124, USA.
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