Irvine, Calif. - Toshiba America Electronic Components says its Smart Thin Package (STP) for power MOSFETs is the thinnest surface-mount type in its class, providing the smallest mount area per milliohm of on-resistance and improving power dissipation ratings for the first MOSFETs using the package, the company's TPCT4201 and TPCT4202. The new package is about one-third the size of a TSSOP-8 and only 0.6 mm high. It also features what the company refers to as lead(Pb)-free finish terminals (may contain greater than 0.1 percent Pb content by weight in portions of the product other than the terminals).
The 12-V dual n-channel TPCT4201 and TPCT4202 devices are suited to lithium-ion battery applications. The TPCT4201 device offers an on-resistance of 25.5 milliohms at Vgs = 4.5 and a source-to-source voltage rating of 20 volts. The TPCT4202 device offers an on-resistance of 30.5 milliohms and a source-to-source rating of 30 volts. Both devices carry a maximum power dissipation of 1.7 watts, DC drain current of 6 amps, pulse drain current of 24 amps, and low leakage current (10 microamps). These components include a built-in gate-source zener diode for electrostatic discharge (ESD) protection.
Samples of the STP MOSFETs are available now, priced at 40 cents each. They'll shortly be in mass production.