Available from Florida RF Labs, a Smiths Interconnect company, is an alternative to long wire bonding connections between components, which produce inductance in the circuit and to gold plating on the PC Board, which increases cost.
The gold-plated range of wire bonding islands can be mounted between two components being wired together using shorter wire leads and therefore reducing overall parasitics in the circuit. Wire bonding islands feature the option of using a tab for easy connection to a circuit and benefit of a standard thickness of only 0.015 inches (0.38mm).
Other thicknesses are available upon request. In addition, the components can be manufactured to customer request. Manufactured from aluminium substrate, the devices feature a wire bondable gold conductor, the tab contact is made of beryllium copper and gold plated per MIL-T-10727. The ground plane is made of silver.
Florida RF Labs / Smiths Interconnect, London NW2 7UH, UK.