Henkel Technologies has announced the availability of its Loctite 5252, a medium viscosity, UV and moisture curing sealant designed for post-assembly use on electronic module enclosures. The material is particularly well suited for high-volume automotive electronics manufacturing.
Based on a polyether rubber technology, Loctite 5252 is a thixotropic sealant that offers controlled flow, dispensing easily and fully sealing seams without seepage or dripping. The rapid UV cure characteristic of the product significantly improves throughput, as it allows users to tack the material within seconds and proceed to subsequent processes.
Other beneficial features include a secondary moisture cure mechanism that guarantees complete cure even in shadowed areas and a sealant-incorporated fluorescent dye which enables online inspection for accurate and complete application. Because of the high bond strength of Loctite 5252, proper sealing is guaranteed for the life of the sealed devices.
This product is ideally suited for passenger compartment, underbody and some under hood modules, and will withstand temperature ranges from 40°C to +125°C.
Henkel Technologies, Olean, NY 14760, USA.