AMIS parent company of AMI Semiconductor, has confirmed that it is developing an EEPROM memory module based on its 0.35-micron (I3T) smart power technology. Known as FREEPROM, the module will increase the company's non- volatile memory (NVM) capabilities for mixed-signal products.
Designed to provide NVM functionality for calibration or data gathering, the FREEPROM memory will reinforce AMI Semiconductor's position as a real System-on-Chip (SoC) provider for the automotive, medical and industrial
industries. The memory module will complement existing flash and OTP memory options that AMIS already offers on this technology platform to the OEMs in these markets.
AMI Semiconductor's FREEPROM memory module will be available for all devices based on the company's CMOS 0.35-micron semiconductor technologies. These include I3T Smart Power mixed-signal technologies that allow system designers to integrate complex digital circuitry, embedded microprocessors and high-voltage functionality into a single IC. AMIS technology experts are leveraging a NVM concept already implemented and in production in C5 and C3 technologies.
The FREEPROM module will be developed in the native semiconductor process, eliminating the need for an extra layer. This will help to keep cost of the technology, to which the module is added, steady. It is anticipated that the new memory module will meet the requirements of the AEC Q100 "grade 0" product qualification process for temperatures up to 150 degrees C and endurance up to 100,000 write cycles. The first products embedding this capability are already in development and will be released to production by Q3 2005.
"NVM is essential for a variety of calibration, code and data storage requirements in automotive applications, as well as other designs expected to operate in harsh environments," said Herve Branquart, worldwide automotive
strategic manager, for AMI Semiconductor. "By adding the FREEPROM memory to existing flash and OTP memory options, AMIS will be able to further improve the overall bill of materials of OEM electronic modules. This will be achieved
through the integration of the stand-alone EEPROM component of their applications, and by then offering a single chip solution that uses the reliable, high-voltage, mixed-signal process technology of the new capability."