In a drive to meet market demands for smaller electronic products, Philips Semiconductors has unveiled the industry's smallest BiCMOS logic devices (74LVT125 BQ and 74LVT126 BQ) in the Depopulated very-thin Quad Flat-pack No-leads (DQFN) package. With DQFN packaging, Philips is able to offer the same performance characteristics of today's larger BiCMOS logic devices in a package that is 35% smaller, as well as a solid roadmap to continue cost reductions.
Ideal for space-constrained, performance-hungry applications such as networking and telecommunications equipment, set-top box solutions and many other computing appliances, Philips' BiCMOS logic devices in DQFN packaging will enable designers to further shrink circuit boards or free board space for additional components and functionality.
The DQFN-packaged BiCMOS logic devices are designed for logic gates and octals. They incorporate an exposed die paddle, with 20% improvement in heat dissipation over a comparable TSSOP package. The package is lead-free and eliminates assembly problems related to co-planarity and bent-lead issues. Its inductance is 60% less than in TSSOP, capacitance is 30% less, and package performance is up to 20% better due to the shorter wire length and internal traces.
The DQFN package is designed for inline pin-outs, which makes new board design (or conversion from TSSOP) easier and less expensive.
Philips Semiconductors, 5600 MD Eindhoven, The Netherlands.