Chattanooga, Tenn. Advanced Technical Ceramics Company offers engineers a new design guide on advanced electronic packages manufactured with co-fired multi-layer ceramic technology. Typical applications include multi-chip modules, microwave packages, high frequency feed-throughs, crystal packages, custom pin grid arrays and ceramic/metal packages.
The guide includes a basic process overview and ceramic specifications for HTCC (alumina) and AlN (aluminum nitride) ceramic materials. Structural and metallization interconnect capabilities are shown with appropriate tolerances. The guide also discusses the design of special features and components for custom applications. Unique AdTech product and design capabilities include self-aligning seal rings and pedestals, refractory metal stand-offs, chemical milling of metal components and design assistance for electromagnetic and thermal simulation of ceramic packages.
An overview of the new guide is available online at www.adtechceramics.com/design.htm