SMSC and TransDimension announced the industry's first successful completion of USB-IF On-The-Go (OTG) compliance testing of a Hi-Speed USB solution utilizing a stand-alone transceiver.
TransDimension's Hi-Speed USB controller IP with a UTMI+ Low Pin Interface (ULPI) interface block and SMSC's USB3300 ULPI stand-alone physical layer transceiver (PHY), are the first Hi-Speed USB products to pass OTG compliance testing, which is governed by the USB Implementers Forum (USB-IF). ULPI modifies the well-known UTMI+ link/PHY interface to significantly reduce the pin count necessary for discrete USB transceiver implementations to support host, device or OTG functionality. This low pin count interface allows transceivers to be kept separate from the associated digital ASICs as the technology nodes become smaller and integrating the PHY becomes more complex and expensive.
"The announcement of this OTG milestone demonstrates the solid performance of a ULPI-based Hi-Speed USB system. The ability to remove the 5-volt tolerant transceiver from the SoC will allow system developers to speed time-to-market and mitigate risk as they move into smaller and smaller process geometries," said Pete Todd, Vice President of Marketing at TransDimension. "Until the development of ULPI, the only external transceiver option open to the SoC community involved a UTMI+ interface which could entail anywhere between 22 and 55 pins. This collaboration with SMSC has now proven that the same functionality and performance can be achieved with the 8 and 12 pin variations of a ULPI interface."
"Adding to our recent announcement of the industry's first ULPI Transceiver to achieve USB-IF Hi-Speed certification, today's announcement further raises the bar by offering ASIC and SoC designers the ability to incorporate Hi-Speed USB host support in their products." said Steve Nelson, Vice President of Marketing " Connectivity Solutions at SMSC. "Driven by the explosion of digital photography, the highly competitive portable consumer electronics market is now mandating that products such as MP3 players, PDAs, digital cameras and cell phones provide Hi-Speed USB host control of external peripheral devices without a PC. Partnering with TransDimension has again paid dividends by accelerating the extensive interoperability testing required to reach this significant milestone."
The USB3300 is SMSC's third generation Hi-Speed USB stand-alone PHY and the first that utilizes the low pin count ULPI interface. Delivering the industry's smallest Hi-Speed USB PHY solution, the USB3300 is available in a 5mm x 5mm x 0.9mm 32-pin QFN package. Leveraging reductions in footprint, profile, pin count and current consumption, the USB3300 is ideal for the portable handheld electronics market including devices such as digital still cameras, PDAs, cell phones and MP3 players. Qualification samples and production quantities of the SMSC USB3300 are available today. Pricing is $2.00 per unit (U.S. list price) in 10K quantities.
The ULPI interface is the latest enhancement to TransDimension's industry-leading Hi-Speed USB OTG IP that currently has 18 licensees and over 6 million units in production. TransDimension's Hi-Speed USB IP family including host, peripheral and OTG designs, is delivered as foundry independent source code with verification environments and synthesis scripts, and is available for immediate delivery. Pricing is available upon request.