San Jose, Calif. OSRAM Opto Semiconductors has released its new generation of white light-emitting diodes (LEDs) for small mobile terminals. The company says the new surface-mount Micro SIDELED module, measuring 0.8 mm high, is the smallest available to offer key display features including critical side-beam characteristics, high brightness and extremely small size. In addition, the module incorporates electrostatic discharge (ESD) protection via an on-board diode.
Suitable for mobile phones, personal digital assistants (PDAs) and other handheld devices where small size and bright light are requirements, the device can also be used in automotive applications to provide backlighting for navigation systems, radios and other instruments.
Manufactured using thin-film technology, the indium gallium nitrite (InGaN)-based LED has shrunk in size from 1.0 to 0.8 mm, and at the same time, has achieved increased brightness. With an operating current of 20 milliamps (mA), the Micro SIDELED now achieves 800 millicandela (mcd). This is an increase over previous solutions by approximately 200 mcd. Silicone, which ages much more slowly than the epoxy resin used previously, is utilized as the encapsulation material, and this increases the life of the LED by a factor of ten, explained the company.
In addition, the ESD diode integrated directly in the Micro SIDELED packaging enables component manufacturers to eliminate any additional costly and time-consuming measures to handle ESD issues. The new module meets the requirements of the European Union's Waste Electronic and Electrical Equipment and Restriction of Hazardous Substances (WEEE/RoHs) directives that bans lead from electrical and electronic equipment by January 1, 2006.
Pricing ranges from $0.30 to $0.50, depending on volume. Delivery is six to eight weeks.
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