Plano, Tex. SyChip has developed the industry's thinnest and the company's first 802.11g plug-and-play module based on its proprietary integrated passive device (IPD) technology. Developed as a means for miniaturizing mobile handheld devices including smart phones, PDAs, gaming devices and media players, the new module integrates dozens of high Q passive components including baluns, bandpass filters, capacitors, inductors and resistors onto a silicon substrate.
By using the company's proprietary IPD technology, SyChip has developed a complete 802.11g plug-and-play module in a 9 x 9-mm footprint with a height of only 0.9 mm. The technology enables the integration of approximately 50 passive components including capacitors, filters, and inductors, directly into the IPD substrate, providing enhanced performance along with a large reduction in the number of discrete components required.
Performance enhancements are realized by minimizing component and trace parasitic effects while minimizing passive losses. In addition, fewer discrete components result in reduced assembly time and cost.
The IPD technology also incorporates the silicon chipset, including the baseband/MAC processors, EEPROM, and transceiver. The module comes in a ball grid array (BGA) structure that allows direct mounting to the primary printed circuit board using surface-mount technology for high-volume production.
Pricing is $29 in quantities of 50,000.
Call (972) 202-8888