Nashua, N.H. Optimized for tight packaging applications without impeding air flow, Teradyne Inc. Connection Systems Division (TCS) has launched its new Aptera connector platform that offers a low-profile solution for server, storage, and networking applications, as well as scalability for future system design requirements. The new solution offers a mix of high speed, low speed, and power daughtercard and backplane modules.
Tom Pitten, vice president of development engineering at TCS said the company worked closely with its customers to develop a solution for tight slot pitch applications where thermal management is a significant challenge. He said the low-profile design of the Aptera connector doesn't impede air flow and provides mechanical integrity that is more robust than standard card edge connectors.
The low-profile Aptera connector addresses difficult packaging challenges by balancing a high-speed interconnect with the need to conserve board space and to maximize air flow. The connector leverages proven interconnect technology including press-fit on the backplane and blind mate connections with keying and guidance. In addition, the solution's modular architecture enables designers to optimize the solution to their applications.
The connector's 10-mm (.39 inch) slot pitch offers flexibility for applications that need high-performance connectors in tight spaces. Electrical test results demonstrate excellent transmission characteristics and cross talk of less than 2% at a 50 picosecond (ps) rise time (20% to 80%) as a result of dedicated shields within the connector. It also provides zero skew and a matched impedance interface that reduces reflections.
The connector features a straddle mount design with solder leads for the daughtercard and press fit for the backplane. The new solution also provides dedicated power delivery and sequencing on the card edge, and supports various daughtercard thicknesses.
Consisting of high-speed differential (15 signal pairs per inch), single-ended (22 signals per inch), power (15 contacts per inch), and a low-speed versions (46 signals per inch), the modularity of the Aptera connector solution helps designers optimize the card edge by allowing them to choose appropriate connection types and the amount of signals for their applications.
Sample volumes will be available in April 2005. Volume pricing is anticipated to be $.08 to $.12 per mated line. Teradyne will exhibit the new product at DesignCon 2005, February 1 to 2 in Santa Clara, California, Booth 211.
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