San Jose, C.A. SiRF Technology Holdings, Inc today announced the GSC3f and the GSC3 family of integrated, low-power GPS products that are based on the company's SiRFstarIII architecture. Designed for use in aided-Global Positioning System (A-GPS) receivers, the devices combine a complete A-GPS digital baseband processor, RF front end, and 4 megabits of flash memory in a single 7 mm x 10 mm package.
The chips are designed to provide designers of cell phones, PDAs, digital cameras and other portable and wireless devices with a drop-in A-GPS solution they can use to deliver real-time location and navigation capabilities in a simpler, smaller design with extended battery life.
Able to track more than 20 satellites, the devices achieve a Time To First Fix (TTFF) of one second for aided starts in outdoor GSM environments and acquires signals down to -159 dBm, making real-time navigation practical in challenging environments such as urban canyons and dense foliage. Unlike the lengthy sequential search process of traditional GPS architectures, the GSC3f and the GSC3 (without internal flash memory) products feature the equivalent of more than 200,000 correlators (as compared to a few hundred to a few hundred to a few thousand correlators in traditional approaches.
The GSC3f and the GSC3 are housed in a 140-pin BGA package. The digital section of both the GSC3f and GSC3 includes a GPS signal processor that handles all the time critical and low latency acquisition, tracking and reacquisition tasks autonomously, and a 50-MHz ARM7TDMI processor designed to run OEM user applications.
The GSC3f has integrated 4-megabit flash memory, eliminating the need for an external flash component. Supporting multiple reference frequencies, the RF section of the GSC3f and GSC3 is designed to bring many components that were previously on the board into the silicon, while keeping RF current consumption to 13 mA.
The GSC37871 is priced under $10. Click here for the GSC3 data.
SiRF Technology Holdings, Inc.
, 1-408-467-0410, www.sirf.com