Corpus Christi, Tex. A new technique developed by TT Electronics IRC Advanced Film Division makes it possible to produce custom thick-film circuits and assemblies that allow high current-carrying traces (up to 100 amps) to be printed directly onto ceramic substrates for power hybrids or solid-state relay substrates. The new technique is said to provide design engineers with high power circuits and assemblies at lower costs than typical direct-bonded copper methods.
Typical applications include solid-state relay substrates, power amplifiers, power supplies, thermo-electric coolers, water level sensors and high-brightness LED circuits.
"By using these custom thick-film circuits, design engineers can integrate current sense resistors with values as low as 2 milliohms directly into the power hybrid substrate which is not a possibility with direct bonded copper," said Tom Morris, applications engineering manager for IRC Advanced Film Division, in a statement. He said these circuits can be printed directly on a heat sink, which eliminates the additional costs and processes of mating the heat sink to a power substrate.
Because most applications are custom, pricing and lead times are available on request.
IRC Advanced Film Division,1-361-992-7900, www.irctt.com