East Grinstead, UK Laird Technologies introduces the T-gon CP200 and CP230 mid-grade thermally conductive insulator pads. They target a wide variety of electronic applications, enhancing heat transfer and promoting cooling by eliminating air gaps between hot components such as power semiconductors and heat sinks or housings. When a component - such as an electronic device - is brought into contact with a heatsink, research has shown that the average contact area can be as low as 2%, with the rest being a small but definite air gap. Air is a very poor thermal conductor and so the flow of heat from the hot component to its heatsink is restricted. The air gap must be filled with a thermally conductive medium so as to obtain the best performance from a heatsink and to keep the operating temperature of the component to a minimum. Thermally conducting pads, such as T-gon, provide the answer. They are relatively soft and designed to conform to the contours of the two surfaces thus reducing the thermal resistance between the components. In this way, heat transfer is greatly increased, and the life of the electronic component is extended. T-gon pads can also provide electrical insulation up to 5,500V if required. CP200 is 0.2 mm thick, while CP230 is 0.230mm thick. Both are made from glass-fibre covered with a ceramic powder filled silicone, a design that gives excellent performance characteristics: high thermal conductivity, excellent dielectric strength and a wide temperature operating range (-60 to +180°C), tailor-made for many thermal conduction applications. Laird Technologies Ltd , East Grinstead, UK. www.lairdtech.com.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.