Boise, IdahoMicron Technology Inc. has introduced very low-profile (VLP) memory modules in 512-Megabyte and 1-Gigabyte densities for rack-mounted blade server applications.
The 512-Mbyte, 64-Mbit X 72 device, part number MT18HTF6472Y-40EB3, and the 1-Gbyte, 128-Mbit X 72 device, part number MT18HTF12872Y-40EB4, are DDR and DDR2 VLP registered dual-inline memory modules (RDIMM) that offer a profile height of 18.3 millimeters or 0.72 inches.
By using vertical sockets vs. angled memory sockets, the RDIMMs allow server system designers to reduce memory area by 62% compared with traditional DDR RDIMM designs. Vertical sockets also help increase air flow to minimize thermal issues.
"Micron's new high-density VLP RDIMMs, significantly boost overall blade server memory capacities while remaining compatible with all existing RDIMM sockets," said Terry Lee, executive director of Advanced Technology and Strategic Marketing for Micron's Systems Memory Group. "Micron's innovative VLP RDIMMs reduce the space and thermal challenges through advances in component and module design."
The company would not release pricing information.
Datasheet links: www.micron.com/products/modules/ddr2sdram/index.html www.micron.com/products/modules/ddrsdram/
Micron Technology Inc., 1-208-368-3900, www.micron.com