Marlow, UK T660 high performance thermal grease from Chomerics has been designed for use in high power applications that require maximum thermal performance. The material is non-curing, dispensable and highly conformable. It requires no mixing and is ideal for filling both wide and narrow gaps resulting from variable package tolerances between components and heatsinks or heatspreaders. It is a phase change material containing small, performance enhancing conductive particles that melt at 62 °C. This characteristic helps ensure a minimal bond line and filling of air voids at the component / heatsink interface to maximise thermal conductivity. The material requires virtually no compressive force in order to deform and flow. It is pale grey in colour and has a thermal conductivity of 0.9 W/m-k. It is supplied in 3, 15 or 30cc syringes ready for dispensing. Bulk packaging is also available. The high performance thermal grease is suited to even the most difficult and demanding applications having a continuous use operating temperature range of –50 °C to +200 °C. For applications that do not require the highest performance thermal interface solution Chomerics also offers T650. This material, which is blue in colour, has a thermal conductivity of 0.8 W/m-k and has all the application characteristics and benefits of T660. Chomerics Europe , Marlow, UK. www.chomerics.com.
David Patterson, known for his pioneering research that led to RAID, clusters and more, is part of a team at UC Berkeley that recently made its RISC-V processor architecture an open source hardware offering. We talk with Patterson and one of his colleagues behind the effort about the opportunities they see, what new kinds of designs they hope to enable and what it means for today’s commercial processor giants such as Intel, ARM and Imagination Technologies.