Irvine, Calif.—Addressing the demand for higher current and higher frequency power solutions for DC/DC converters, Toshiba America's TB7001FL multichip module (MCM) combines a driver IC with a MOSFET and the company's MOSBD, a single-die combination of a power MOSFET and a Schottky barrier diode, in one package measuring just 8-by-8-by-0.85 mm. The new MCM represents a level of integration beyond the company's dual-channel MOSBD product, which combines a high-side MOSFET with a low-side MOSFET/Schottky barrier diode.
"With this device, Toshiba is responding to customer demand for higher power, faster response time, increased precision, and higher efficiency all in a smaller structure for their portable devices," said Sam Abdeh, business development specialist for power products. "This new MCM showcases Toshiba's expertise in innovative packaging for components targeted for use in ever-smaller consumer electronic devices by integrating three key devices into a single module to give design engineers the ability to produce more powerful, yet smaller mobile products."
The MCM, using its IC (with level shifter) stage and MOSFET to drive the high side of a converter and its MOSBD to drive the low side, can deliver up to 20 amps at 1.5 volts (maximum operating voltage to the power stage is 19 volts). Designed to work at switching frequencies to 1 MHz, the multichip module boasts an efficiency of greater than 84 percent (for a 12-volt input).
Built-in functions include a low-side MOSBD shutdown input, thermal shutdown, and under-voltage protection.
The TB7001FL is lead(Pb)-free and is RoHS-compatible. Customer samples of the TB7001FL are available now and it's priced at $4.50 each in sample quantities.
Toshiba America Electronic Components, 1-949-623-2900, www.chips.toshiba.com