San Jose, Calif. Designed to replace existing 1/4-inch VGA image sensors and 1/4-inch VGA systems-on-a-chip (SoC) image sensors in camera phones, the newly launched suite of 1/4-inch optical format, 1.3-megapixel imaging solutions from Cypress Semiconductor Corp. allows mobile device manufacturers to upgrade their products with improved image quality at a higher resolution while maintaining the same optical format and form factor.
The new CYIWOSC1300AA 1.3-megapixel image sensor and CYIWCSC1300AA 1.3-megapixel SoC image sensor are the first camera phone image sensors manufactured on Cypress's 0.13-micron CMOS process optimized specifically for image sensors. These new image sensors take advantage of Cypress's high fill-factor pixel architecture to significantly improve light sensitivity without sacrificing image quality, according to the company. The pixel architecture also eliminates the need for micro lenses.
The new CYIWOSC1300AA 1.3-megapixel image sensor features a 1/4-inch optical format, a frame rate of more than 15 frames-per-second (fps) at full resolution and image windowing to any size. It also sustains a smooth, continuous video preview at reduced power consumption. The sensor acts as a master in a system, accepting commands from a two-wire serial interface and delivering Bayer-patterned RGB images or video-like streams through a 10-bit parallel data interface.
CYIWOSC1300AA Block Diagram
(Click on Image to Enlarge)
The CYIWCSC1300AA 1.3-megapixel SoC image sensor is an SXGA 1/4-inch format camera that produces high-quality color still pictures, even under very poor lighting conditions, said the company. The 1.3-megapixel SoC combines CMOS imaging technology for high-quality, CCD-like image performance while providing the advantages of CMOS technology high integration, ease of design, low cost, and low power consumption.
The SoC integrates a state-of-the-art image sensor core with an advanced, on-chip image signal processor capable of defect interpolation, black level calibration, lens de-shading, crosstalk compensation, color mosaic interpolation, and color correction. Other features include auto white balancing with illuminant estimation, auto exposure and gain control, sharpening, noise reduction, special effects and gamma correction.
CYIWCSC1300AA Block Diagram
(Click on Image to Enlarge)
The image sensor and SoC feature a pixel size of 2.8-micron x 2.8-micron and an image array format of 1280 x 1024 active pixels. Both devices offer progressive scan and an electronic rolling shutter.
Cypress is currently sampling the CYIWOSC1300AA with production volumes expected in December 2005. Samples of the CYIWCSC1300AA will be available in fourth quarter 2005 followed by production quantities in second quarter 2006. Pricing for both devices is expected to be below $3.00 each, in quantity.
Cypress Semiconductor Corp., 1-408-943-2600, www.cypress.com/1.3Mp_Imager