San Jose, Calif. Toshiba America Electronic Components, Inc. (TAEC) has expanded its Dynastron complementary metal oxide semiconductor (CMOS) image sensor product line with the addition of a new 3.2-megapixel CMOS image sensor chip, aimed at high-end camera-enabled mobile handsets.
The new ET8E99-AS chip offers a small 2.7-micron pixel pitch with a 1/2.6-inch optical format and incorporates an analog-to-digital (A/D) converter in a non-diced wafer form.
ET8E99-ES Block Diagram
(Click on Image to Enlarge)
In video mode, the new ET8E99-AS chip is capable of a high-speed frame rate of 15 frames per second (fps) at QXGA output and 30 fps at 3-to-1 vertical pixel binning. Power consumption is rated at 240 mW at 15 fps QXGA output. It also incorporates automatic blemish correction and detection, gain control, lens shading compensation and a phase locked loop circuit. It may be used with a companion Toshiba image signal processor (ISP) chip that provides YUV or JPEG encoded data or with another suitable external ISP chip.
Touting high image quality with low-power consumption, thanks to the company's Dynastron technology that use a special square pixel design that enables CCD-quality images with low-power consumption, even in low-light conditions, the company said the new device will help drive the replacement of low-end digital still cameras with high-end camera phones.
Toshiba Corporation (Toshiba) will exhibit the new Dynastron ET8E99-AS CMOS image sensor at CEATEC JAPAN 2005, October 4-8, 2005 at Makuhari Messe.
Samples of the ET8E99-AS are available with mass production planned for the end of 2005 at a monthly output rate of 300,000 units or greater. Sample pricing is $45.00 each in quantities of 1,000 pieces per year.
Toshiba America Electronic Components, Inc., 1-408-526-2400, www.chips.toshiba.com